Package: kmod-hwmon-w83793
Version: 4.4.61-1
Depends: kernel (=4.4.61-1-1f514e36c8fb769cc69d3d9049fecfac), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: arc_archs
Installed-Size: 17906
Description:  Kernel module for the Winbond W83793G and W83793R chips.
