Package: kmod-hwmon-w83793
Version: 4.4.89-1
Depends: kernel (=4.4.89-1-ed0f4ec1d6dc8e26b3083154e2c123fa), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: arm_fa526
Installed-Size: 13263
Description:  Kernel module for the Winbond W83793G and W83793R chips.
