Package: kmod-hwmon-w83793
Version: 4.4.140-1
Depends: kernel (=4.4.140-1-b1506c0d7493dc300de29f612ad3a37a), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: mipsel_mips32
Installed-Size: 14301
Description:  Kernel module for the Winbond W83793G and W83793R chips.
