Package: kmod-hwmon-w83793
Version: 4.4.153-1
Depends: kernel (=4.4.153-1-8f274e8b465cd9859e195af30c247f31), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: arc_arc700
Installed-Size: 18207
Description:  Kernel module for the Winbond W83793G and W83793R chips.
