Package: kmod-hwmon-w83793
Version: 4.4.182-1
Depends: kernel (=4.4.182-1-83927efe12b7ccc206f2d8757cbce42f), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: mips_24kc
Installed-Size: 14867
Description:  Kernel module for the Winbond W83793G and W83793R chips.
