Package: kmod-hwmon-w83793
Version: 4.4.182-1
Depends: kernel (=4.4.182-1-00a385b943105c8437d62b06ff9e3704), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: armeb_xscale
Installed-Size: 13589
Description:  Kernel module for the Winbond W83793G and W83793R chips.
