Package: kmod-hwmon-w83793
Version: 4.9.152-1
Depends: kernel (=4.9.152-1-def6b4b6fd5b0fd8587fe8dbf55baf5c), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: mips_24kc
Installed-Size: 14860
Description:  Kernel module for the Winbond W83793G and W83793R chips.
