Package: kmod-hwmon-w83793
Version: 4.14.171-1
Depends: kernel (=4.14.171-1-cb9b381ec7a00a59a8144fa7ca05c817), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: mips_24kc
Installed-Size: 15274
Description:  Kernel module for the Winbond W83793G and W83793R chips.
